• 股票简称: 安泰科技
  • 股票代码: 000969
热等静压扩散连接

通过热等静压技术可以使两种及两种以上的同质或异质材料通过扩散焊接作用连接在一起,连接方式包括固体-粉末、固体-固体的扩散焊接。尤其在相互焊接的各种材料间性能差异较大或者界面比较复杂时具有其他焊接方式无法比拟的优势。

型号: HIP1250 制造商: 安泰科技粉末与制品分公司热等静压
联系人: 销售:李经理 主管:陈总 原产地: 河北省涿州市
邮箱: hip@atmcn.com 电话: 0312-3852260/0312-3852730
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扩散连接:使同质或异质材料相互扩散

Enable inter-diffusion bonding of homogeneous or heterogeneous materials

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异质材料扩散连接界面

Connection interface of heterogeneous materials diffusion

HIP扩散连接是在密闭的容器中,在原子快速移动的高温下施加压力,从而使紧密接触的表面在固态下连接到一起的焊接工艺。HIP可以连接两种不同的材料,如金属-金属、金属-非金属、非金属-非金属,根据两种材料热力学性能的差别考虑是否添加过渡层元素。从材料形态上来讲可以是粉-固、固-固、粉-粉连接。

HIP diffusion bonding is a welding process, that, in a closed container, pressure is applied under the high temperature, so that the surface will be bonded together. HIP can connect two different materials, such as metal-metal, metal-nonmetal, nonmetal-nonmetal; whether transition layers are needed or not depends on the thermodynamics properties of the two (or more) materials. The bonding types can be powder-solid, solid-solid and powder-powder.

l连接相同性能材料时,由于界面不产生液相,界面结合强度与母材相当;

l连接不同性能材料时界面可实现良好的冶金结合,且性能不低于两种材料中的较低者。

l可以连接接触面具有复杂形状的零件,并实现严格的尺寸控制;

l可在一道工序中连接多个同类或异类材料;

l可使常规焊接方法无法连接的脆性金属实现固态连接;

l由于作用在零件上的等静压力高且均匀因此减少及消除了在连接区外侧的微小气孔。

lFor bonding of materials with the same properties, because the liquid phase is not exist at the interface, the interfacial bonding strength is equal to that of the base metal;

lMaterials with different properties can achieve perfect metallurgical bonding, and the performance of the composite is no less than the lower of the two.

lAble to bond parts with irregular contact surface and realize the strict size control.

lAble to bond more than two kinds of similar or dissimilar materials in one process;

lAble to realize the solid connection of brittle metals that cannot be connected by the conventional welding method;

lBecause of the high isostatic pressure, the small pores outside the joint district are reduced or eliminated.